Tezpur University Project Associate I Recruitment 2026 - Apply Offline for 01 Post

Age limit

Candidates shall not be more than 35 years of age on the last date of receipt of applications. Upper age limit may be relaxed as per Government of India rules.

Eligibility details

• Essential Qualification: Master’s Degree (M.Tech / M.E. / M.S.) in Mechanical Engineering, Manufacturing Technology, Production Engineering, Material Science, Metallurgy, Aerospace Engineering, Automobile Engineering, Ocean and Naval Architecture, Applied Mechanics, Civil Engineering, or any allied area.
• Preference will be given to candidates with research experience.

Important Dates and Notes

• Date of Advertisement: 07-01-2026
• Last Date to Receive Application: Within 15 days from the date of issue of the advertisement (07-01-2026)
• Updated information: January 10, 2026 (time stamps and updates are not part of the application timeline)

Application fees

No information about application fees is provided in the notice. If applicable, it should be referenced from the official notification.

General Instructions

• Applications in prescribed format (Annexure-I) are invited for a temporary position of Project Associate-I for the IITG-TIDF sponsored project entitled “Experimental characteristics and thermo-mechanical analysis of underwater friction stir welded AI Alloys for submerged marine applications.”
• The position is under the Principal Investigator Dr. Prabin Haloi, Assistant Professor, Department of Mechanical Engineering, Tezpur University, Tezpur, Napaam - 784028, Assam.
• If currently employed or pursuing Ph.D., a No Objection Certificate must be submitted from the concerned employer/ph.d. supervisor.
• Interested candidates must email their CV and Annexure-I to the Principal Investigator within 15 days from the date of advertisement.
• Shortlisted candidates will be called for a personal interview; original documents and self-attested copies must be presented at the time of interview.
• No TA/DA will be provided for attending the interview.